SECO
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SECO’s Embedded OS Guards Smart IoT Devices Against Cyberthreats

Aug. 29, 2025
Latest OS update offers long-term support and enhanced cybersecurity for the next generation of smart devices.

Cybersecurity is at top of mind for system designers and integrators, especially those in the smart-everything arena. When assembling the software stack, it’s helpful to know that your embedded operating system is working in your favor. With that in mind, SECO’s latest release of its Clea OS is now the default embedded Linux distribution for all of the company’s hardware products.

Version 2.0 of the Yocto-based and hardware-agnostic OS gives designers a unified foundation for projects on both Arm and x86 architectures. It also enables deployment of edge services such as remote OS and application updates, as well as optimized AI workloads and enhanced security for integrated payment systems.

Critically, Clea OS v2.0 gives smart devices a solid footing for fending off cybersecurity threats ranging from device vulnerabilities and insecure communications to data breaches. The future of digital product regulation hinges on enforcement of new legal frameworks like the European Union’s Cyber Resilience Act and Radio Equipment Directive, which mandate cybersecurity provisions for connected devices.

Clea OS v2.0 offers a cybersecurity services package enabling OEMs to directly address key regulatory requirements such as automated generation of a software bill of materials (SBOM), integrated vulnerability management, and regular security update patches.

Related links:

Clea OS

Demonstration

SECO home page

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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