CEVA
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CEVA and DARPA Partner for Technology Innovation

Jan. 5, 2021
Commercial partnership under new DARPA Toolbox initiative provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IP.

Through a new open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), CEVA hopes to accelerate technology innovation for DARPA programs. The partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all CEVA’s commercially available IPs, tools, and support to expedite their programs.

CEVA’s partnership with DARPA extends the reach of the company’s advanced DSPs, AI processors, and wireless IP to the DARPA research programs and its ecosystem. It’s hoped that CEVA’s broad and low-power platforms for 5G, Wi-Fi 6, Bluetooth, computer vision, and sound and motion sensing will help to accelerate innovation within DARPA.

The DARPA Toolbox initiative is a new, agency-wide effort aimed at providing open licensing opportunities with commercial technology vendors to the researchers behind DARPA programs. Through DARPA Toolbox, successful proposers will receive greater access to commercial vendors’ technologies and tools via pre-negotiated, low-cost, non-production access frameworks and simplified legal terms. For commercial vendors, DARPA Toolbox provides an opportunity to leverage the agency’s forward-looking research and a chance to develop new revenue streams based on programmatic achievements developed with their technologies.

CEVA, along with Arm and Verific, comprise a first wave of technology companies to sign commercial partnership agreements under DARPA Toolbox. As licensees of CEVA IP, DARPA researchers stand to benefit by having access to CEVA’s processors, tools, and support for technical areas that intersect with CEVA’s wireless-connectivity and smart-sensing portfolios. Key technologies offered by CEVA under the initiative include DSPs and software for 5G baseband processing, short-range connectivity, sensor fusion, computer vision, sound processing, and artificial intelligence.

CEVA, www.ceva-dsp.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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