Mini-Circuits, Modelithics Offer Free Full 3D Models for Ansys HFSS

Aug. 21, 2020
Mini-Circuits partners with Modelithics to offer free, full-3D Ansys HFSS models over 40 LTCC filters.

Mini-Circuits has partnered with modeling and simulation vendor Modelithics to offer full 3D models for Ansys HFSS for over 40 of Mini-Circuits’ most popular LTCC filters. The models are now available for free download from the Modelithics website as a resource to customers in the simulation stage for new system designs. The companies plan further development of additional 3D models for HFSS on an ongoing basis.

Mini-Circuits’ advanced modelling capability for its LTCC products lends itself to consistent first-spin agreement between simulations and measured results for lumped and distributed circuits up to 60 GHz. The free downloads for HFSS extend the benefits of Mini-Circuits’ proprietary design knowledge to system designers for PCB prototyping and system performance optimization on the industry-standard tool for 3D simulation of full-wave electromagnetic fields.

Modelithics employed proprietary methods to further refine and fully validate the 3D models against measured results and extend usability for different substrates, substrate thicknesses, land patterns, and materials. With this latest addition, the Modelithics Library now includes over 100 advanced models for Mini-Circuits parts including S-parameter data models, substrate scalable models, X-parameter data models, and Ansys HFSS 3D models.

Mini-Circuits,; Modelithics,

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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