Packaged MMICs Cover X-Band Systems

Dec. 12, 2008
THE 8-TO-12-GH X-BAND is home to many communications and radar technologies. To support those ever-evolving application areas, some packaged highpower- amplifier, monolithic-microwave integrated circuits (MMICs) provide moderate output power ...

THE 8-TO-12-GH X-BAND is home to many communications and radar technologies. To support those ever-evolving application areas, some packaged highpower- amplifier, monolithic-microwave integrated circuits (MMICs) provide moderate output power with high gain at X-band. These amplifiers cover the full X-band range in three separate bands. Model 560134, which targets 9-to-10.5-GHz applications, provides +37 dBm output power and 40-percent power added efficiency (PAE) for a bias of 7 V, 1.4 A. Typical gain is 18 dB. The other members of the family include model 560141 for 7 to 8.5 GHz and model 560142 for 10.5 to 12 GHz. All of the devices are packaged in the SMX 580448 ceramic surfacemount package, which has a copper-composite base that enhances thermal dissipation. Although it is sealed with epoxy and a liquid-crystal-polymer lid, it will pass fine and gross leak hermeticity testing per MIL-STD-883B. This family of packaged devices is especially well suited for point-to-point radios and base stations. P&A: approximately $259 for 500 units.

StratEdge, 6335 Ferris Square, Suite C, San Diego, CA 92121; (866) 424-4962, Internet: www.stratedge.com.

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About the Author

Nancy Friedrich | RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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