Packaged MMICs Cover X-Band Systems

THE 8-TO-12-GH X-BAND is home to many communications and radar technologies. To support those ever-evolving application areas, some packaged highpower- amplifier, monolithic-microwave integrated circuits (MMICs) provide moderate output power ...
Dec. 12, 2008

THE 8-TO-12-GH X-BAND is home to many communications and radar technologies. To support those ever-evolving application areas, some packaged highpower- amplifier, monolithic-microwave integrated circuits (MMICs) provide moderate output power with high gain at X-band. These amplifiers cover the full X-band range in three separate bands. Model 560134, which targets 9-to-10.5-GHz applications, provides +37 dBm output power and 40-percent power added efficiency (PAE) for a bias of 7 V, 1.4 A. Typical gain is 18 dB. The other members of the family include model 560141 for 7 to 8.5 GHz and model 560142 for 10.5 to 12 GHz. All of the devices are packaged in the SMX 580448 ceramic surfacemount package, which has a copper-composite base that enhances thermal dissipation. Although it is sealed with epoxy and a liquid-crystal-polymer lid, it will pass fine and gross leak hermeticity testing per MIL-STD-883B. This family of packaged devices is especially well suited for point-to-point radios and base stations. P&A: approximately $259 for 500 units.

StratEdge, 6335 Ferris Square, Suite C, San Diego, CA 92121; (866) 424-4962, Internet: www.stratedge.com.

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About the Author

Nancy Friedrich

Nancy Friedrich

RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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