CML Microcircuits
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CML Micro Shifts Focus to RF-to-mmWave Capability

June 8, 2023
The company is extending its reach into higher-frequency devices, such as PAs, LNAs, and gain blocks up to 100 GHz, in an effort to break into new markets such as defense and security.

This article is part of our IMS 2023 coverage.

CML Micro will be in Booth 655 at IMS 2023 to spread the word about the expansion of its technology offerings. The company is now developing more advanced RF, microwave, and mmWave devices for transformative applications, centered around its SµRF product range of GaAs- and GaN-based devices. The company recently acquired capabilities to extend its reach into microwave and mmWave devices, including power amplifiers (PAs), low-noise amplifiers (LNAs), and gain blocks up to 100 GHz, all in hopes of reaching new markets such as security and defense.

Among the CML Micro products displayed at IMS will be the recently introduced CMX90B701 and CMX90B702 low-current, low-noise gain blocks for the 17- to 23-GHz and 23- to 29.5-GHz bands, respectively. Both devices have an ultra-low current consumption of 10 mA with a typical P1dB output figure of +7.5 dBm, an IP3 output of +17.5 dBm, and a noise figure of 4 dB. The devices are housed in a low-cost 3- × 3-mm QFN package, and are fully matched to 50 Ω.

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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