X-FAB Silicon Foundries
1020 Mw X Fab And Attopsemi I Fuse On Rf Soi Promo 5f7e21d63f0f2

OTP Memory IP Is Qualified on X-FAB’s 130-nm RF-SOI Process

Oct. 7, 2020
Attopsemi’s I-fuse one-time-programmable technology, combined with X-FAB’s RF-optimized process technology, aims to satisfy the memory requirements of 5G technology.

With an eye toward integrating digital content with analog trimming or data storage in next-generation 5G New Radio deployments, X-FAB Silicon Foundries has joined forces with Attopsemi to qualify the latter’s I-fuse one-time-programmable (OTP) IP on X-FAB’s XR013 130-nm RF-SOI process. As a result, designers can now incorporate a compact, robust OTP block into the core XR013 technology module, but without any additional or custom processing. With read operation possible at both 2.5 V and 1.8 V for MIPI compatibility, the collaboration satisfies the memory requirements of 5G technology.

X-FAB’s XR013 is an open-platform, 130-nm technology that’s optimized for RF applications including cellular infrastructure, Wi-Fi connectivity, automotive V2X communications, IoT, and more. A key benefit of using Attopsemi’s I-fuse OTP memory on the XR013 RF platform is the flexibility with which RF products can address different regional market requirements via a single chip design (as different configurations can be stored). This will lead to project development cost savings, as well as facilitating inventory management.

Attopsemi’s I-fuse, a fuse-based OTP technology, is said to be far more reliable with much smaller cell size and programming current than typical electrical-fuse technology. It limits programming current below a catastrophic breaking point as opposed to breaking a fuse, and uses a junction diode instead of MOS as a program selector in an OTP cell.

The qualified Attopsemi I-fuse OTP solution is available for clients from X-FAB’s customer portal.

X-FAB Silicon Foundries, www.xfab.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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