LTCC Bandpass Filters Serve C-band 5G Front Ends
Space on PCBs for RF front ends is typically in short supply, so it’s incumbent on component suppliers to provide RF designers with suitably compact choices. In hopes of filling some of that need, Bourns now offers its FBP1604N470L3, FBP1608N375L3, and FBP2007N470L3 low-temperature co-fired ceramic (LTCC) bandpass filters.
The multi-layer ceramic RF components fit high-frequency applications from 3,300 to 5,000 MHz, serving the 5G C-band spectrum. They integrate multiple passive elements into a single monolithic structure, giving designers miniaturized options for RF front-end designs.
RF front-end designs for 5G equipment require filtering components that maintain defined frequency response and insertion loss limits. The three FBP models cover frequency ranges of 3,300 to 4,200 MHz and 4,400 to 5,000 MHz with maximum insertion loss ratings from 0.9 to 1.7 dB at +25°C (depending on the model).
Package sizes are 1.6 × 0.8 × 0.35 mm (FPB1608N375L3), 1.6 × 0.8 × 0.4 mm (FBP1604N470L3), and 2.0 × 1.25 × 0.65 mm (FBP2007N470L3). The products support operating temperatures from –40 to +85°C, with the FBP2007N470L3 model specified from –40 to +105°C.
Target applications include enhanced mobile broadband (eMBB), Fixed Wireless Access (FWA), and private 5G network deployments.
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

