High-Speed Edge-Card Sockets Enhance Signal Integrity, Shorten Signal Paths
A series of 0.80-mm-pitch edge-card sockets from Samtec features the company’s Edge Rate contact system, which is specifically designed for high-speed, high-cycle applications. The Generate (HSEC8) series of interconnects deliver exceptional signal fidelity in applications such as computers and peripherals, telecommunications, datacom, industrial equipment, medical, test and measurement, instrumentation, and military and aerospace.
The milled surface of the sockets’ Edge Rate contact creates a smooth mating surface area, unlike a stamped contact that mates on a cut edge. It reduces the wear tracks on the contact, increasing the durability and cycle life of the contact system. The smooth surface also lowers insertion and withdrawal forces, allowing the connectors to be zippered when unmating.
Generate 0.80-mm-pitch edge-card sockets offer several advantages over a two-piece connector system. For one, edge-card connectors shine in modular designs, enabling designers to easily upgrade or configure their system by swapping out the printed circuit board. For another, the sockets’ design facilitates mating and unmating when the card requires higher cycle counts. And, micro edge-card sockets deliver high signal speeds due to their contact design as well as shorten signal paths by using one less connector.
The HSEC8 series of Generate 0.80-mm-pitch edge-card sockets are available in vertical, right angle, and edge-mount configurations. They can be equipped with optional side latches for increased card retention. In addition, the latches can be used to mate cable assemblies and optional board locks and weld tabs for the mechanical strength of the part on the board.
The sockets are designed for mating card thickness of 0.062 or 0.093 inches, and they're available with a power/signal combination design, among other configurations.
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David Maliniak
Executive Editor, Microwaves & RF
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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.