Molex
0921 Mw Molex 5 G Connectors Promo 61534a29cbdc0

mmWave RF Connectors Grant Freedom to Mobile Device Manufacturers

Sept. 28, 2021
Molex’s robust micro-connector, meant for next-generation antenna modules, meets demanding 5G mmWave applications up to 25 GHz.

The Overview

Hoping to aid makers of RF antenna modules—and designers of mobile devices—in saving space on printed-circuit boards while optimizing high-speed 5G components, Molex's new Flex-to-Board RF mmWave Connector 5G25 series of interconnects supports high-speed data transfers in a compact footprint.

Who Needs It and Why?

Let’s say you’re designing an RF antenna module, or, even better, the main board in a new mobile device on which that module will reside. Space is at a premium, but so is high-speed connectivity and support for 5G, which, for the foreseeable future, mobile devices must possess. According to Molex’s recent global survey, The Future of Mobile Devices, 82% of respondents expect consumers will see substantial benefits from their mobile devices within five years. Further, respondents ranked mmWave 5G as the leading disruptive technology in smart mobile devices. Thus, Molex’s 5G25 series of interconnects could be among the elements that make that next-generation mobile flagship happen.

Under the Hood

The Molex Flex-to-Board RF Connector 5G25 series supports high-speed data transmission of up to 25 GHz in a very small interconnect that offers extra protection from harsh environmental conditions. With a signal pitch of 0.35 mm, a mated body height of only 0.6 mm, and a short body width of 2.5 mm and length of 3.6 mm, the compact connectors increase flexibility for PCB designers. Moreover, the 5G25 enables designers of RF antenna modules and mobile devices to combine RF and non-RF signals, which reduces the need for additional connectors while producing additional space and cost savings. 

The 5G25 features full electromagnetic-interference (EMI) shielding, encompassing both RF terminal and full connector shielding to ensure superior signal integrity. By employing a center shield-in contact with receptacle and plug, each row can be isolated to boost overall signal-integrity stability. Additionally, Molex’s fully-shielded design delivers excellent far-field gain performance, which is ideal for connecting 5G antennas to the rest of the transceiver.  

The Molex Flex-to-Board RF Connector 5G25 series facilitates fast, trouble-free assembly with excellent “click feeling” to prevent faulty mating. Additionally, the ultra-compact connectors feature robust peel force to increase reliability and minimize the load on assembly operators or automatic assembly machines. 

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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