Creating a Coherent Connected Battlefield
Given the ongoing trend of melding of sensing and communications in both defense and commercial applications, it makes sense for an analog giant like Analog Devices Inc. (ADI) to create as much synergy between those technologies as possible.
In this video, ADI’s Bryan Goldstein, vice president of Aerospace, Defense, and Communications, discusses the company’s strategy in the burgeoning development of the wirelessly connected battlefield.
Demand grows in this space for faster decision-making, greater situational awareness, and distributed operations that don’t rely on a fixed communications infrastructure. ADI and other suppliers to the defense industry are pressed to bring disparate data streams from a multitude of sensors into actionable intelligence.
In the case of Analog Devices, the company’s long history and large portfolio of solutions for every part of the RF signal chain positions it for success in the quest to improve battlefield operational efficiency. It also seeks to shorten design and development cycles for defense contractors as they push toward new, more integrated communications systems.
A key element of ADI’s strategy for defense applications is found in its Quad-Apollo mixed-signal front-end digital beamforming platform. The platform serves as a complete reference architecture for next-generation digital beamforming systems.
Learn more about the connected battlefield
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.