EnSilica Teams with 5G-aNTeNna Consortium
Seeking to strengthen the European Union’s (EU’s) IRIS satellite communications (satcom) infrastructure, notably at Ka-band frequencies, EnSilica has joined the 5G-aNTeNna consortium for 5G wireless satcom networks. EnSilica’s ASICs are expected to help create secure, scalable Ka-band 5G-NTN user terminals. The consortium, led by Silicon Austria Labs (SAL) and featuring CISC Semiconductor, FRITZ!, TechniSat, and Terma Technologies, hopes to bolster the ground wireless communications technology needed for Europe’s next-generation satcom systems.
EnSilica’s role in the consortium is based upon a strong background in RF/microwave, digital, and mixed-signal ASICs and how such devices can be employed in electronically steered phased-array antenna systems. By contributing such components as modem ICs and various analog, digital, and mixed-signal ICs needed for digital beamforming in phased-array systems, EnSilica hopes to make the next generation of 5G satcom ground terminals for 5G-aNTeNna a reality (see figure).
According to Ian Lankshear, chief executive officer (CEO) of EnSilica, “EnSilica’s involvement in the 5G-aNTeNna consortium is a natural extension of our work in satellite communications silicon and of our collaboration with other European partners.” Lankshear adds: “As satellite networks move towards wider deployment of 5G-NTN services, compact, electronically steerable user terminals will be critical, and our focus is on enabling the semiconductor technologies that make these systems practical and manufacturable for high-volume use.”
About the Author
Jack Browne
Technical Contributor
Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.





