Push-on Microwave Interconnects Handle Tough Connectivity Challenges
Corning released two push-on microwave interconnect series, the G3PO and G4PO , which have a floating interconnect system that enables the system designer to work with looser alignment tolerances, lowering assembly time and complexity. The high-performance connectors provide a high-frequency interconnect solution for military, satellite, wireless, and telecommunications applications.
The G3PO Interconnect Series is a high-frequency (65 GHz & 100 GHz) connectivity solution for telecommunications, radar systems, shipboard, airborne, ground-based, missile programs, cryogenic, and non-magnetic applications. Available in SMA, 1.85 mm, and 2.4 mm, the 0.016-g connector offers a blind-mate interconnect with a center-to-center spacing of 0.085 in. and is designed to handle both radial and axial misalignment with negligible voltage standing wave radio (VSWR) change.
The G4PO Interconnect Series is a ultra-high-density connectivity solution that enables high-frequency (60 GHz) connections even in constrained environments without open access. With center-to-center spacing of 0.070 in., board-to-board spacing of 0.090 in., and a weight of 0.005 g, this series is available in SMA, 1.85 mm, and 2.92 mm.
Related links:
Corning
G3PO
G4PO
Microwave Connectivity Solutions