Dreamstime_networkcammeraydave_20106200 and Spectrum Control
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Signal-Source SiP Pairs With mmWave Block Upconverter SiP

June 9, 2025
The two systems-in-package enable smaller PCBs, quicken development cycles, and help simplify manufacturing.

Browse our complete IMS 2025 coverage.

Spectrum Control (Booth #927) is unveiling its low-jitter, high-frequency signal source system-in-package (SiP) and 18- to 40-GHz mmWave block upconverter SiP at IMS 2025. The stable, high-frequency, signal-source SiP is a complete system of clocks with up to four buffered (or divided) high-frequency clocks paired with synchronous system reference signals for JESD interfaces, as well as one FPGA signal.

The SiP's small footprint (0.75 × 1.75 in.) makes it possible to shrink board size, and it speeds up development and manufacturing.

The mmWave block upconverter upconverts standard 2- to 18-GHz bands into mmWave signals (18 to 40 GHz) in a 30-mm2 BGA package. It can be paired with Spectrum Control’s 18- to 40-GHz block downconverter SiP to adapt a 2- to 18-GHz direct-sampling system to support mmWave frequencies.

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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