0920 Mw Via Lite Rf Over Fiber Link Promo 5f5fca379ea3f

Mil-Aero RF-over-Fiber Link Covers 10 MHz to 6 GHz

Sept. 14, 2020

The versatile link serves a broad range of defense-oriented applications on land, sea, and air.

ViaLite Communications’ new Mil-Aero RF over Fiber Link pair, which spans a frequency range of 10 MHz to 6 GHz, is specifically tailored for demanding Air Force and navy applications, Army telemetry systems, signals intelligence (SIGINT) deployments, tethered aerostat and drone applications, plus multi-service military electronic warfare systems; and any applications where fiber is an essential replacement to coax.

The versatile new RF-over-fiber links covers bands from HF, VHF, and UHF through to telemetry and satcom bands P, L, S, and C. It also offers the best spurious-free dynamic range (SFDR) performance in its class, making it ideal for high bandwidth applications or where the application has a large range of RF signal powers. The link is further enhanced by a low noise figure (NF) and optional gain and 1-dB compression points (CP).

Supporting distances of up to 50 km, the Mil-Aero link is available in rack, chassis card, or OEM module formats, including ViaLite‘s new black OEM design which is rated for outdoor use. All formats come with a standard 5-year warranty.

ViaLite, www.vialite.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.