Corralling Materials For Microwave Circuits

June 4, 2013
Understanding dielectric material parameters can help simplify the process of choosing the right printed-circuit-board (PCB) material for a design.

Engineers in need of a starting point for their high-frequency printed-circuit boards (PCBs) will find them by comparing notes with members of Rogers Corporation’s Advanced Circuit Materials division at IMS booth No. 1459. Visitors to the booth will learn about Rogers’ next generation RO4000® circuit materials, notably RO4835™ high frequency laminates. RoHS-compliant RO4835 laminates offer a dielectric constant of 3.48 and a low loss tangent of 0.0037 at 10 GHz, plus a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions. These improved oxidation resistant circuit materials exhibit x- and y-axis expansion coefficients similar to those of copper, for excellent dimensional stability. Rogers Corp. will also be represented in the IMS technical program by Market Development Engineer John Coonrod, author of the “ROG Blog.” His talk, “Determining Circuit Material Dielectric Constant from Phase Measurements,” is scheduled at 3:30 PM Tuesday, June 4, in the MicroApps Theatre on the IMS exhibition floor.

Editor's Note: For more show coverage, be sure to visit Microwaves & RF's IMS 2013 page.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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