Tower Semiconductor Solidified By $40 Million In Bonds

June 13, 2007

Israel's independent semiconductor foundry Tower Semiconductor Ltd. has accepted orders from Israeli institutions for approximately $40 million in long-term bonds with an average duration of 5.6 years. The company is currently in the final stages of its Fab2 manufacturing capacity ramp-up to 24,000 wafers per month. This fundraising will enable Tower to further expand its Fab2 capacity beyond such 24,000 level, primarily in advanced technologies (0.13 microns and below), in a cost effective manner that capitalizes on current unique tools acquisition opportunities.

Tower Semiconductor Ltd. (www.towersemi.com)

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.