Key Features
- Cures in shadowed out areas with heat
- Curing temperature 80-85°C
- Excellent elongation
- Low modulus, low stress
- Outstanding thermal cycling properties
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for shadowed areas, typically curing in 60-90 minutes at 80-85°C. The system's adaptability to varying depths and applications, such as encapsulation and bonding, enhances its versatility.
UV23FLDC-80TK has a viscosity of 25,000-50,000 cps, and is highly thixotropic, which is advantageous for applications where minimal flow is required. It has a low tensile modulus of 250-500 psi, and a high elongation of 90-100% at room temperature. Its toughness and flexibility allow it to withstand rigorous thermal cycling, making it well-suited for applications where low stress is critical. The system features excellent electrical insulation with a volume resistivity exceeding 1014 ohm-cm.
UV23FLDC-80TK is not susceptible to oxygen inhibition. It bonds well to metals, glass, ceramics and many plastics, including but not limited to acrylics and polycarbonates. It has a service temperature ranging from -80°F to +300°F. This system may be used in fiber optics applications including mounting optics, bonding fiber terminations into ferrules, laminating and sealing glass plates, especially when low stress upon substrates is an important consideration. It also can be used in electronics as an encapsulant and in semiconductor applications as a glob top.