LPKF Lands Largest Order In Firm's History

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Sept. 17, 2009

LPKF is making new believers in its laser-based circuit-manufacturing equipment, recently announcing an order of more than $8.75 million for laser systems for manufacturing three-dimensional (3D) embedded cellular telephone antennas from a major international electronics group. LPKF Chief Executive Officer (CEO) Dr. Ingo Bretthauer, notes that the order underlines the growing acceptance of Molded Interconnect Devices (MIDs) for mass-production applications using LPKF's laser direct structuring (LDS) technology: "This order, the biggest in our company history, marks the final breakthrough into mass production of our MID technology." The MIDs are 3D circuit carriers made of plastic resin and structured and activated using a laser beam.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.