Toshiba Electronic Devices Storage Corp 607b4ccba5d94

Toshiba Electronic Devices & Storage Corp.

TAEC offers a broad IC and discrete product line including high-end microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications.
5231 California Avenue
Irvine, CA 92617
(949) 509-4200
(949) 509-9925
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More Info on Toshiba Electronic Devices & Storage Corp.

Toshiba Electronic Devices Storage Corp 607b4ccba5d94

Toshiba America Electronic Components, Inc. (TAEC) is the North America electronic components business of Toshiba. TAEC offers a broad IC and discrete product line including high-end microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products including Enterprise and Consumer HDDs.

Toshiba offers a wide range of semiconductors and storage products, making us a single-source option for a number of solutions and customers. We work closely with OEMs, ODMs, CMs, VARs as well as retailers and our distribution partners to define the right product mix and new technology innovations. Through proven commitment and lasting relationships, Toshiba semiconductors and storage products make possible todays' latest smartphones, tablets, ebooks, digital cameras, head mounted devices, medical devices, automotive applications, networking, enterprise applications, and PC and notebook storage.

TAEC was established in 1989, providing design, manufacturing, marketing and sales, with offices in United States and Latin America. 

Articles

A low-power LTE-M and NB-IoT connectivity solution joins over 1000 other standard peripheral development boards.
The characteristics of different substrates and device architectures make it possible to reach many speeds and frequencies with modern semiconductor devices and their packages...
Expect 2016 to be a busy year, as plans are in motion to create technologies with capabilities that push past the boundaries of today’s state-of-the-art solutions.
Many technologies—developed and newer alike—are being touted as potential solutions to the problem of integrating analog, digital, and RF components on the same chip.
To meet the size, integration, and performance requirements of next-generation communications and defense application, companies are leveraging unique and even proprietary, process...

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