Quik-Pak manufactures overmolded QFN/DFN packages and pre-molded air cavity QFN packages that provide a fast, convenient solution for prototype to full-production needs.
Quik-Pak, a division of Promex, provides IC packaging, assembly, and wafer preparation services in its ISO 9001:2015, ISO 13485:2016, and ITAR-registered facility in San Diego, California. Quik-Pak manufactures overmolded QFN/DFN packages and pre-molded air cavity QFN packages that provide a fast, convenient solution for prototype to full-production needs. Same-day assembly services are provided to shorten time to market. Quik-Pak also provides high-volume IC assembly services utilizing its automated assembly and molding equipment for production runs in the 10,000s of units. In addition to wire bond assembly, the company assembles flip chips, BGAs, stacked die, sensors, MEMS, chip-on-board (COB) and chip-on-flex assemblies.
