ODU-USA
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Mass Interconnect Delivers Flexibility in Test Systems

July 1, 2025
Up to 4,608 signal contacts and an array of modules adapts the mass-interconnect device to interface a wide range of inputs to test equipment.

Serving as the interface between a test fixture or device under test (DUT) and test equipment, ODU USA’s ODU-MAC Black-Line mass-interconnect solution is geared toward testing printed circuit boards or electronic assemblies. The device addresses myriad user requirements by using a combination of different modules that allow for a high degree of customization.

The ODU-MAC Black-Line can be equipped with 12 floating ODU-MAC Blue-Line connector frames. A variety of modules are available, including signal, power, high-current, high-voltage, RF signals (coax), compressed air and fluid, vacuum, high-speed data, and fiber optics. The largest version of the Black-Line can accommodate up to 4,608 signal contacts and eight latch points to ensure a balanced, safe, and reliable mating process. With all of the guidance and latch features, it enables consistent quality for 20,000 mating cycles and more.

Two versions of the ODU-MAC Black-Line are fitted with a hand lever for applications with less than 2,400 signals, or where it's required. There’s also a version with an electromechanical locking system that establishes a connection between receiver and adapter by simply pushing a button. Moreover, it can be automated via remote control or integrated into an inline tester.

Further variations concern mounting variants: rack mount, slide mount, or tabletop. The rack variant is built directly onto the control cabinet by means of mounting plates. The slide mount makes it possible to remove the ODU-MAC Black-Line from the cabinet easily for maintenance or wiring. Lastly, a tabletop version serves smaller-signal-count applications.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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