Pickering Interfaces

Pickering to Showcase MEMS-Based PXI/PXIe Multiplexers

June 7, 2023
The new multiplexers are said to provide longer operational life, faster speeds, and higher bandwidths than electromagnetic relay alternatives.

This article is part of our IMS 2023 coverage.

In its IMS Booth 1415, Pickering Interfaces will display its extensive range of RF and microwave switching products, including the first modules in a new MEMS-based RF PXI/PXIe multiplexer family.

The RF multiplexer family, which is well-suited for wireless communications and semiconductor test, is powered by Ideal Switch MEMS devices from Pickering’s partner, Menlo Microsystems (Booth 450). These are among the first MEMS components on the market with the performance characteristics to support demanding RF testing requirements.

The new MEMS-based RF multiplexers are claimed to deliver vastly increased operational life (up to 300X), faster operating speed (up to 60X), and higher bandwidth (with no reduction in RF power handling) versus traditional electromechanical relay (EMR) alternatives. Insertion loss also remains comparable with EMR switches and much lower than solid-state options.

In addition to the new RF multiplexer family in PXI/PXIe, Pickering will also highlight:

  • Its new 110-GHz PXI/PXIe microwave switch supporting 5G and semiconductor test.
  • The new Microwave Design Tool, a free online tool for configuring flexible LXI microwave switch products.
  • A flexible LXI microwave switch platform and turnkey services for LXI microwave switch and signal-routing subsystems (including a custom 12x12 LXI microwave switching matrix demo).
  • A selection from Pickering’s portfolio of other switches, along with its PXI, PXIe, and LXI/USB modular chassis, simulation products, and cables and connectors.

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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