This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.
Creating systems using the latest technology can be a challenge because it often takes advantage of the circuit board technology, high speed communication and advanced power management. Developers can become familiar with all these aspects and design a board and system or they can let someone else handle the heavy lifting by using a system-in-package (SIP).
A custom circuit board is still needed but the SIP provides a simplified interface making that board design easier. The board is often simpler with fewer layers because the SIP handles that complexity. This series examines issues, approaches and advantages of SIP technology for embedded developers.
Push your X-band testing further with dual-channel power and precision from 8 to 12.5 GHz. Mini-Circuits’ SSG-8N12GD-RC delivers coherent or non-coherent outputs, modulation flexibility...
Accurate RF measurements depend on more than just high-end equipment—connector quality and care are critical. Learn best practices for selecting, maintaining, and inspecting RF...
Wider bandwidths push RF systems to their limits—don’t let power measurement hold you back. Mini-Circuits' sensors deliver precision up to 9 GHz, without the high cost.
CMT's VNA software includes a powerful trace math feature that enables users to compare signal amplitude and phase, assess amplifier stability, perform differential measurement...
