This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits into it all.
Creating systems using the latest technology can be a challenge because it often takes advantage of the circuit board technology, high speed communication and advanced power management. Developers can become familiar with all these aspects and design a board and system or they can let someone else handle the heavy lifting by using a system-in-package (SIP).
A custom circuit board is still needed but the SIP provides a simplified interface making that board design easier. The board is often simpler with fewer layers because the SIP handles that complexity. This series examines issues, approaches and advantages of SIP technology for embedded developers.
The R&S®RadEsT radar essential tester is a game changer in automotive radar sensor testing, enabling manufacturers to rapidly qualify radar sensors with high accuracy while dramatically...
Discover the components and structure of automotive electronic systems and how innovative test products and systems from Rohde & Schwarz address the entire vehicle.
Learn about two solutions to automate testing against the Chinese national GNSS test standard with R&S CMW run sequencer software and a vector network analyzer.
Delivering 30 dB gain from 8–12 GHz, discover how the compact 3.5W MMIC amplifier is built for high-PAPR signals in radar, wireless, and VSAT—perfect when space and performance...
