More from the APEC 2023 Floor

March 24, 2023

Here's another dose of the latest new products from the show floor at this week's Applied Power Electronics Conference in Orlando.

David Maliniak

Related To: Microwaves & RF

Check out our APEC 2023 digital magazine for more show coverage.

The Applied Power Electronics Conference (APEC) prides itself as the "premier global event in power electronics," and rightly so. This 38th edition of APEC, running from March 19 to 23 in Orlando, represents an in-person coming-out party of sorts, as the conference, like the rest of society, continues its rebound from the pandemic. Here's a second helping of interesting new items we found while traversing the show floor:

Silicon Authentication ICs Facilitate Qi 1.3 Wireless Charging
Switched-Capacitor Charge Pump and Two-Stage Buck-Regulator IC Debut at APEC
High-Current Power Inductors Target Military and Avionics Markets
900-V GaN Flyback-Switcher ICs Serve Industrial and Automotive Tasks
Molded Ceramic Semiconductor Packages Offer Effective Heat Dissipation

Check out our APEC 2023 digital magazine for more show coverage.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.