Sequans Communications
1122 Mw Skyworks Sequans Sky66431 Si P Promo 637d26ed8c7f4

Skyworks and Sequans Debut Tiny LTE-M/NB-IoT SiP Solution

Nov. 22, 2022
This highly integrated SiP delivers a robust device for massive IoT communication systems, simplifying designs and boosting battery life.

The Overview

The SKY66431, a 5G massive IoT system-in-package (SiP), combines Sequans Communications’ Monarch 2 modem with Skyworks’ RF front-end solution. The result, it’s claimed, is the world’s smallest LTE-M/NB-IoT connectivity platform in a single package.

Who Needs It & Why?

Low-power, wide-area network (LPWAN) products have become essential to critical infrastructure, meeting stringent operational requirements for durability, battery lifespan, and reliability. The SKY66431 is designed to address the increasing demand for form-factor-driven cellular LPWAN end points. These include utility meters, asset trackers, security and alert systems, and other battery-powered devices such as medical wearables and fleet management. The number of installed LPWAN devices is expected to reach 2.4 billion by 2026.

Under the Hood

The SKY66431 is a highly integrated multiband, multichip SiP supporting 5G massive IoT platforms, offering high-performance connectivity with ultra-low power consumption. The native 23-dBm front-end module leverages Skyworks’ RF design and advanced packaging expertise that optimizes reliability in demanding environments, allowing for extremely small footprint designs while maintaining simplified PCB design rules. With SiP-form-factor-enabling miniaturization and fully encapsulated silver-free conformal shielding, the device enables ultra-compact, flexible, and robust end-product designs.

The SKY66431 is being certified by several industry and regulatory agencies, as well as multiple network operators. This SiP is available now for select customers, with general availability expected in the first quarter of 2023.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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