Development Ecosystem Drives G3-PLC Hybrid Connectivity into Smart Devices

Feb. 17, 2021

Seeking to accelerate G3-PLC Hybrid connectivity in smart-grid and IoT devices, a pair of development kits centers on ST's ST8500 PLC modem chipset.

David Maliniak

Related To: Microwaves & RF

To accelerate G3-PLC Hybrid connectivity in smart-grid and IoT devices, STMicroelectronics has debuted a development ecosystem for its ST8500 programmable powerline-communication (PLC) modem chipset.

Comprising two evaluation boards targeting the 868-MHz and 915-MHz license-free RF bands, with documented firmware, the ecosystem helps users quickly build and test nodes that comply with G3-PLC Hybrid, the industry’s first published standard for dual PLC and RF connectivity.

Equipment such as smart meters, environmental monitors, lighting controllers, and industrial sensors containing the ST8500 chipset, which supports G3-PLC Hybrid, can select the powerline or wireless channel autonomously and change dynamically to ensure the most reliable connection.

Launched in 2019, the chipset combines the ST8500 protocol controller system-on-chip (SoC), which runs ST’s G3-PLC Hybrid firmware, with the STLD1 PLC line driver and S2-LP sub-GHz radio. Devices containing the chipset are backward-compatible and interoperable with any G3-PLC network.

ST’s hybrid protocol stack is based on G3-PLC, IEEE 802.15.4, 6LowPAN, and IPv6 open standards. By embedding support for RF Mesh at the physical (PHY) and data-link layers, the ST8500 combines the strengths of powerline and wireless mesh networking for communication between smart nodes and data collectors. Unlike simple point-to-point links, hybrid mesh-networking interconnects nodes extensively to improve reliability, strengthen fault-tolerant connections, and extend communication distance.

The two new hardware development kits handle PLC and RF connectivity as well as application processing. The EVLKST8500GH868 kit is configured for 868-MHz RF operation as recommended in the EU, while the EVLKST8500GH915 kit operates in the 915-MHz band used throughout the Americas and Asia. Each kit comes with the STSW-ST8500GH software framework and documentation.

Ready to combine with an STM32 Nucleo board for scalable application processing and compatible with ST’s large portfolio of X-NUCLEO expansion boards for convenient function extension, the kits provide a platform for developing a wide range of smart-grid and IoT applications.

The EVLKST8500GH868 and EVLKST8500GH915 are available now from ST and distributors for $250.

STMicroelectronics, www.st.com/st8500-pr

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.