Qualcomm Technologies
0221 Mw Qualcomm 5 G Modem Rf System Promo 60245da709137

Qualcomm Readies for the Future with First 10-Gb 5G Modem-RF System

Feb. 10, 2021
Upgradeable architecture means fast rollouts of new features for 5G in mobile broadband, computing, XR, industrial IoT, private networks, and fixed wireless access apps.

The promise of 5G technology to deliver extremely high data rates is only possible with a complete modem-to-antenna system. Achieving 5G’s speed potential requires very tight integration of all elements of that system. In its Snapdragon X65 5G Modem-RF System, Qualcomm claims it has satisfied these requirements and then some. The Snapdragon X65, the company’s fourth generation of such systems, is said to be the world’s first 10-Gigabit 5G and the first 3GPP release 16 modem-RF system.

Snapdragon X65 is poised to support a new generation of premium smartphones and the expansion of 5G in segments such as PCs, mobile hotspots, industrial IoT, fixed wireless access, and 5G private networks. Qualcomm Technologies is also introducing a widely accessible sibling of the Snapdragon X65 – the Snapdragon X62 5G Modem-RF System. The Snapdragon X62 is a 5G modem-to-antenna solution supporting up to multi-Gigabit downloads for mobile broadband applications.

The tight modem-RF integration and advanced modem-RF technologies will help OEMs deliver superior data speeds, coverage, call quality, and support for all-day battery life in a sleek form factor to the consumer. With multi-gigabit 5G enabled by the Snapdragon X65 5G Modem-RF System, consumers will have access to fiber-like browsing speeds and low latency, delivered wirelessly over 5G for the next generation of connected applications and experiences, including cloud- and edge-based computing, highly responsive multiplayer gaming, rich entertainment, immersive 360° video, and instant apps.

The system boasts numerous impressive features, not least among them being an upgradable architecture that allows for enhancements, expandability, and customization across 5G segments. It also enables major new forthcoming features, capabilities, and rapid rollout of new 3GPP Release 16 features via software updates. This upgradeable architecture allows for future-proofing of solutions based on Snapdragon X65, facilitating adoption of new features, extending device lifespan, and helping reduce total cost of ownership—especially as 5G expands into new vertical industries such as computing, industrial IoT, and fixed wireless access.

Comprising part of the modem-to-antenna system, the Qualcomm 545 fourth-generation mmWave antenna module pairs with the new Snapdragon X65 Modem-RF System to support higher transmit power as compared to the previous generations, as well as support for all global mmWave frequencies, including the new n259 (41-GHz) band, while maintaining the same tiny footprint as the previous generation.

Another key feature of the Snapdragon X65 Modem-RF System is what Qualcomm terms the world’s first AI antenna tuning technology, heralding the incorporation of AI research and development into mobile-RF systems. This allows for major improvements in cellular performance and power efficiency. For instance, the use of AI increases accuracy in detecting hand grips by 30% compared to the previous generation. This improvement supports enhanced antenna tuning capabilities, which leads to faster data speeds, better coverage, and longer battery life. Speaking of the latter, Qualcomm’s 5G PowerSave 2.0, builds upon new power-saving technologies defined in 3GPP Release 16, such as Connected-Mode Wake-Up Signal.

The system provides comprehensive spectrum aggregation across all key 5G bands and combinations, including mmWave and sub-6 GHz, using frequency division duplex (FDD) and time division duplex (TDD), providing operators ultimate flexibility in the use of fragmented 5G spectrum assets.

One more key feature is Qualcomm’s Smart Transmit 2.0, a system-level technology licensed by Qualcomm Technologies for use with the Snapdragon X65 Modem-RF System that takes advantage of modem-to-antenna system awareness to increase upload data speeds and enhance coverage for both mmWave and Sub-6 GHz bands while continuing to meet RF emissions requirements.

Snapdragon X65 and Snapdragon X62 are currently sampling to customers. Commercial devices based on these Modem-RF solutions are expected to launch by late 2021.

Qualcomm Technologies, www.qualcomm.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

Sponsored Recommendations

Ultra-Low Phase Noise MMIC Amplifier, 6 to 18 GHz

July 12, 2024
Mini-Circuits’ LVA-6183PN+ is a wideband, ultra-low phase noise MMIC amplifier perfect for use with low noise signal sources and in sensitive transceiver chains. This model operates...

Turnkey 1 kW Energy Source & HPA

July 12, 2024
Mini-Circuits’ RFS-2G42G51K0+ is a versatile, new generation amplifier with an integrated signal source, usable in a wide range of industrial, scientific, and medical applications...

SMT Passives to 250W

July 12, 2024
Mini-Circuits’ surface-mount stripline couplers and 90° hybrids cover an operational frequency range of DC to 14.5 GHz. Coupler models feature greater than 2 decades of bandwidth...

Transformers in High-Power SiC FET Applications

June 28, 2024
Discover SiC FETs and the Role of Transformers in High-Voltage Applications