SiP Modules Reduce Size, Complexity of System Designs
Octavo Systems launched its OSD32MP2 family, featuring two system-in-package (SiP) modules: the OSD32MP2 and OSD32MP2-PM. Thanks to the advanced capabilities of the STMicroelectronics’s new STM32MP25 processor, this family is said to significantly reduce the complexity, size, and total cost of ownership of electronic systems.
The OSD32MP2 family fits a diverse range of applications from industrial automation to consumer electronics. Features of the two modules in the series include:
OSD32MP2: A comprehensive SiP solution integrating the STM32MP2 processor, DDR4 memory, power management (STMPMIC2), EEPROM, oscillators, and passives in a 21- x 21-mm BGA package. This module is designed for designers seeking a straightforward, efficient path to harnessing the full capabilities of the STM32MP2.
OSD32MP2-PM: A streamlined module focusing on the essential integration of the STM32MP2 processor and DDR4 memory in a compact 9- x 14-mm package, ideal for cost-sensitive or uniquely designed projects requiring flexibility in power solutions or form factors.
The OSD32MP2 series is built around the STM32MP25 processor, featuring dual Arm Cortex-A35 cores, an Arm Cortex-M33 core, a 3D GPU supporting Vulkan API, H.264 video encoding/decoding, a 1.35-TOPS AI accelerator, and comprehensive connectivity options. These features enable the development of cutting-edge applications that demand high-performance processing, advanced graphics, and robust security.
Samples of the OSD32MP2-PM will be available at the end of 2024, with the OSD32MP2 samples following in early 2025.
Related links:
OSD32MP2 family
OSD32MP2
OSD32MP2-PM