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Faraday Showcases FPGA-Go-ASIC, SONOS eFlash, and eFPGA Solutions

July 7, 2023
The ASIC design service and IP provider displays a comprehensive array of offerings for a multitude of applications.

This article is part of our Design Automation Conference 2023 coverage.

Faraday Technology comes to Booth 2343 at DAC to discuss its comprehensive line of design services and IP, putting the spotlight on three product offerings:

Faraday's FPGA-Go-ASIC service (see image above) is a comprehensive solution for designers converting an FPGA design to an ASIC, including design services, IP, and a long-term supply commitment. The conversions are said to deliver higher performance with lower system costs, power usage, and board area. These ASICs find use in base stations and small cells, medical imaging, smart grid, industrial robot, and other product areas.

In collaboration with Infineon, Faraday has developed a SONOS eFlash platform for UMC’s 40-nm uLP process. It encompasses eFlash subsystem IP, including controller, timing, and cache functions, with a complete eFlash testing solution. The platform simplifies the utilization of flash-memory technology to meet the demands of AI, smart grid, IoT, and MCU applications.

Also, in partnership with QuickLogic, Faraday now provides an embedded FPGA (eFPGA) solution. This IP solution includes a comprehensive FPGA design and programming software ecosystem to integrate FPGA fabric into ASIC designs, facilitating seamless, flexible post-silicon modifications.

For more information, visit the company's website

For more DAC 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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