Skyworks Solutions Launches 5G Massive IoT SiP, Small-Cell Front End

Jan. 13, 2023
Skyworks' SiP supports 5G massive IoT (LTE-M/NB-IoT) platforms, integrating the entire RF front end, transceiver, power management, memory, crystals, and baseband modem for an LTE multiband radio operating from 698 to 2200 MHz.

Check out more of our CES 2023 coverage.

Skyworks Solutions' Stefan Fulga, director of marketing for IoT products, shows off the company's SKY66431, a multiband, multichip system-in-package (SiP) supporting 5G massive IoT (LTE-M/NB-IoT) platforms. The SiP integrates the entire RF front end, transceiver, power management, memory, crystals, and baseband modem for an LTE multiband radio operating in the 698- to 2200-MHz frequency range. NOR flash, and a few passives external to the package, complete the SiP implementation.

We also get a preview of an initial application for the SKY66431: a reference design for a small-cell front end.

For more CES 2023 news, information, and videos, CLICK HERE.

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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