Texas Instruments
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Standalone Active EMI Filter ICs Support High-Density Power Supply Designs

March 20, 2023
These EMI filter ICs enable engineers to design smaller, lighter, and more affordable power supplies while optimizing system performance, efficiency, and reliability.

Check out our APEC 2023 digital magazine for more show coverage.

In its Booth #916 at APEC 2023, Texas Instruments (TI) is debuting the industry’s first standalone active electromagnetic interference (EMI) filter ICs, enabling engineers to implement smaller and lighter EMI filters. Such filters can enhance system functionality at reduced system cost while simultaneously meeting EMI regulatory standards.

With electrical systems growing denser and more interconnected, mitigating EMI is a critical system design consideration for engineers. TI’s new portfolio of standalone active EMI filter ICs can sense and cancel common-mode EMI by as much as 30 dB at frequencies between 100 kHz and 3 MHz in single- and three-phase AC power systems. This capability enables designers to reduce the size of chokes by 50%, compared to purely passive filter solutions, and meet stringent EMI requirements.

One of the main challenges when designing high-density switching regulators is how to implement a compact and efficient design of the EMI input filter. Through capacitive amplification, these new active EMI filter ICs enable engineers to shrink the inductance value of common-mode chokes by as much as 80%, helping to cost-effectively achieve improved mechanical reliability and increased power density.

The new family of active EMI filter ICs consists of the TPSF12C1 and TPSF12C3 for single- and three-phase commercial applications and TPSF12C1-Q1 and TPSF12C3-Q1 for automotive applications. These devices can efficiently reduce the heat generated in a power-supply EMI filter, which also extends filter capacitor lifetimes and increases system reliability.

The new active EMI filter ICs incorporate sensing, filtering, gain and injection stages. Offered in a SOT-23 14-pin package, the IC integrates compensation and protection circuitry to further reduce the implementation complexity and minimize the number of external components.

By helping to detect, process and reduce EMI in a broad range of ac/dc power supplies, on-board chargers, servers, UPS, and other similar systems where common-mode noise dominates, the devices enable designers to address EMI design challenges and meet CISPR 11, CISPR 32 and CISPR 25 EMI requirements. The ICs also meet IEC 61000-4-5 surge immunity requirements, thus minimizing the need for external protection components, such as transient-voltage-suppression (TVS) diodes.

Pre-production quantities of the automotive grade TPSF12C1-Q1 and TPSF12C3-Q1 are available now, only on TI.com, in a 4.2-mm-by-2-mm SOT-23 14-pin package. The catalog grade TPSF12C1 and TPSF12C3 will be available on TI.com in pre-production quantities by end of March 2023. Pricing starts at US$0.78 in 1,000-unit quantities. The TPSF12C1QEVM and TPSF12C3QEVM evaluation modules are available on TI.com for US$75. TI expects all devices to be available in volume production in the second quarter of 2023 and plans to release additional standalone active EMI filter ICs later in 2023.

Check out our APEC 2023 digital magazine for more show coverage.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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