Teledyne e2v and TI
0223 Mw E2v Ti Rad Hard Ddr4 New 63f691021fb5a

Teledyne e2v and TI Team on Rad-Tolerant DDR4 Memory

Feb. 22, 2023
DDR4 devices from Teledyne e2v and TI’s LDO voltage regulator are paired to comprise a platform that will satisfy stringent SWaP requirements of satellite OEMs.

The Overview

Teledyne e2v and Texas Instruments have collaborated on a radiation-tolerant DDR4 modular platform. The platform consists of e2v’s DDR4T0xG72 DDR4 memory with 4 or 8 GB capacity paired with TI’s TPS7H3301-SP DDR termination low-dropout (LDO) voltage regulator that provides a stable supply for the DDR4 module.

Who Needs It & Why?

Satellite OEMs looking to streamline their system development work while reducing the time and associated engineering effort will find the new platform beneficial. The components that comprise the platform have already been through comprehensive space characterization and qualification testing, enabling the platform to deliver long-term operation without single-event latchup (SEL) and single-event upset (SEU) issues causing problems.

Under the Hood

The DDR4/TPS7H3301-SP platform, which is optimized for deployment under tight size, weight, and power (SWaP) constraints, is very compact and convenient to use. It carries high levels of data-storage capacity within a very small form factor. According to e2v, the platform requires 3X less PCB area when compared to competitive platforms, with a volume that’s smaller by a factor of 10.

With its 4- and 8-GB densities, the DDR4 devices provide a 72-bit bus width, which is typically used as 64 bits of data with 8 bits of error correction. This offers both single- and dual-bit error-correction capabilities. Transfer speeds are 2.1 and 2.4 GT/s (up to 150 Gb/s).

Versatility is another advantagethe DDR4T0xG72/TPS7H3301-SP modular platform is applicable across a wide range of space-grade processors (including Teledyne e2v and others), FPGAs/ACAPs (such as AMD/Xilinx, Microchip, and NanoXplore) as well as custom-built ASICs.

The radiation-validated TI and Teledyne e2v devices that make up this DDR4 platform are featured in Alpha Data’s ADK-VA600 Versal Core development kit.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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