The Overview
Teledyne e2v and Texas Instruments have collaborated on a radiation-tolerant DDR4 modular platform. The platform consists of e2v’s DDR4T0xG72 DDR4 memory with 4 or 8 GB capacity paired with TI’s TPS7H3301-SP DDR termination low-dropout (LDO) voltage regulator that provides a stable supply for the DDR4 module.
Who Needs It & Why?
Satellite OEMs looking to streamline their system development work while reducing the time and associated engineering effort will find the new platform beneficial. The components that comprise the platform have already been through comprehensive space characterization and qualification testing, enabling the platform to deliver long-term operation without single-event latchup (SEL) and single-event upset (SEU) issues causing problems.
Under the Hood
The DDR4/TPS7H3301-SP platform, which is optimized for deployment under tight size, weight, and power (SWaP) constraints, is very compact and convenient to use. It carries high levels of data-storage capacity within a very small form factor. According to e2v, the platform requires 3X less PCB area when compared to competitive platforms, with a volume that’s smaller by a factor of 10.
With its 4- and 8-GB densities, the DDR4 devices provide a 72-bit bus width, which is typically used as 64 bits of data with 8 bits of error correction. This offers both single- and dual-bit error-correction capabilities. Transfer speeds are 2.1 and 2.4 GT/s (up to 150 Gb/s).
Versatility is another advantage—the DDR4T0xG72/TPS7H3301-SP modular platform is applicable across a wide range of space-grade processors (including Teledyne e2v and others), FPGAs/ACAPs (such as AMD/Xilinx, Microchip, and NanoXplore) as well as custom-built ASICs.
The radiation-validated TI and Teledyne e2v devices that make up this DDR4 platform are featured in Alpha Data’s ADK-VA600 Versal Core development kit.