Qorvo
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MMIC Amplifier Boosts K/Ku-Band Satcom Signals

June 9, 2022
Qorvo's MMIC power amplifier is optimized for wide-bandwidth, multi-carrier, high-data-throughput satellite applications.

This article is part of our IMS2022 coverage.

Qorvo will be at IMS2020 (Booth #3030) with its new 20-W GaN-on-SiC power amplifier (PA) for defense and commercial satellite applications, including low-earth-orbit (LEO) constellations. The QPA1724 amplifier operates from 17.3 to 21.2 GHz (Ku/K-band) and offers twice the power of competing PAs, it's claimed, along with excellent wideband linear power, gain, and power-added efficiency in a compact surface-mount package. This device is optimized for wide-bandwidth, multi-carrier, high-data-throughput satellite applications.

Some key performance metrics include:

  • Frequency range: 17.3 - 21.2 GHz
  • PSAT (PIN = 27 dBm): 43 dBm
  • PAE (PIN = 29 dBm): 27%
  • Small signal gain: 25 dB
  • Bias: VD = 20 V
  • Dimensions: 7.5 x 6 x 1.6 mm

The QPA1724 is available now and is lead-free, RoHS-compliant, and 100% DC and RF tested to ensure compliance with electrical specifications.

For more information, visit the product webpage.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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