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Silicon Labs Rolls Out its Wi-SUN IoT Portfolio

April 14, 2021

The company's fully integrated, certified Wi-SUN solution simplifies low-power, wide-area-network (LPWAN) deployment for smart cities.

David Maliniak

Related To: Microwaves & RF

Wi-SUN long-range wide-area-network (LPWAN) technology has made significant inroads in IoT networks, smart cities, and smart utilities implementations. Now, Silicon Labs is introducing standards-driven Wi-SUN technology intended to advance new IoT market opportunities and accelerate smart-city application development. Silicon Labs’ certified Wi-SUN solution combines the company’s EFR32 hardware platform, a full-featured IPv6 mesh stack, and advanced development tools to enable secure wireless connectivity for a broad range of applications, from advanced metering infrastructure (AMI) to street lighting networks, asset management, and smart-city sensors such as parking, air quality and waste management.

Wi-SUN is certified by the Wi-SUN Alliance, a global industry association devoted to seamless LPWAN connectivity. Wi-SUN builds upon standard Internet protocols (IP) and APIs, enabling developers to extend existing infrastructure platforms to add new or emerging applications serving a wide range of industrial and smart-city workflows. Built to scale due to its long-range capabilities, high-data throughput and IPv6 support, Wi-SUN simplifies wireless infrastructure for cities and expanding suburban areas

Silicon Labs’ first family of wireless SoCs to support Wi-SUN is EFR32xG12, a 32-bit Arm Cortex-M4 platform with up to 1 MB of flash and 256 kB of RAM as well as an integrated +20 dBm PA for sub-GHz frequencies. Silicon Labs currently has certified Wi-SUN FSK PHYs and is working with lead customers to bring fully-certified Wi-SUN applications to market. General availability of Silicon Labs’ full Wi-SUN solution is expected early summer 2021.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.