NXP Semiconductors
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2x2 Wi-Fi 6 + Bluetooth Modules Boost Speed and Range in Gaming, Audio, Industrial, and IoT Markets

Oct. 9, 2020
With 1.2-Gb/s data rates, these connectivity solutions bring fluidity and low latency to gaming consoles, smart consumer IoT hubs, AR/VR devices, and more.

Offering increased capacity, efficiency, and overall performance in next-generation gaming, audio, industrial, and IoT products, NXP Semiconductors’ new IW62X family of products is a group of 2x2 Wi-Fi 6 (802.11ax) dual band + Bluetooth/BLE solutions aimed at such cutting-edge applications as the world’s first Wi-Fi 6 enabled gaming console. The devices seek work in a range of connectivity settings including smart consumer IoT hubs, wireless speakers, video-enabled smart devices, augmented and virtual reality (AR/VR) devices and a universe of additional IoT applications.

The new 2x2 Wi-Fi 6 solutions are suited for advanced gaming consoles that demand high-performance Wi-Fi with near-zero wireless controller lag time and low-latency multiplayer gaming experiences (via a single, in-room console) over wireless networks. The IW62X solutions also offer real-time interactions for cloud-based gaming devices, clients, and services by providing high-bandwidth and low-latency connectivity needed for full 4k/60-fps gameplay.

Anticipating exponential growth in Wi-Fi 6 access points and IoT devices tethered to a single gateway, the IW62X devices bring a dramatic boost in speed, a quadrupling of network capacity, and a doubling in bandwidth compared to previous generations of Wi-Fi. This increased capacity with reduced latency supports a significantly higher numbers of users and devices connected to a network or gateway.  

A wide range of robust use cases include:

·        AR/VR headsets, making possible full, completely wireless immersive experiences in HD.

·         Multi-channel home theater audio experiences with wireless speakers and video-enabled smart assistants with full bandwidth to support seamless 4k video interaction and content streaming.

·         Smart IoT hubs, appliances, and accessories; and outdoor and remote IP-enabled security cameras.

·         Consumer, commercial, and industrial IoT solutions for home and building control (smart lighting, building safety and security, and climate control).

The BT/BLE radios support Bluetooth/BLE standards, independent Bluetooth connections, and operational modes with multiple external devices.  These capabilities enable advanced smart-hub and smart-home services that use Bluetooth-based positioning and Mesh connectivity, providing support for numerous applications, including dual/independent wireless headset support, audio streaming via stereo A2DP/isochronous channel, and separate low-power peripheral/accessory control.

The IW62X family features a high level of integration, including 2.4- and 5-GHz dual-band power amplifiers (PAs), low-noise amplifiers (LNAs), and antenna switches. It also includes a power-management unit that substantially reduces system-level BOM (bill of materials) and device board area while also simplifying chip-on-board and integrated-module designs.  

The IW62X family of 2x2 Wi-Fi 6 dual band + Bluetooth solutions is available for sampling now.

NXP Semiconductors, www.nxp.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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