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Murata, Wirepas Team on Industrial IoT Connectivity

Oct. 3, 2020

The former’s embedded Bluetooth module pairs with the latter’s wireless connectivity software to enable massively scalable industrial IoT implementations.

David Maliniak

Creating an industrial IoT implementation requires hardware and software. To that end, Murata has integrated Wirepas’s Mesh wireless connectivity software with its MBN 52832 embedded Bluetooth modules, providing a means to implementation of industrial-grade, large-scale IoT applications for low-power sensor networks.

The combination of Wirepas Mesh with the MBN52832 module provides application developers with a connectivity layer, enabling data collection, device management, and location tracking across multiple applications, including asset management, smart lighting, and industrial IoT. The ultra-low power characteristics of the MBN52832 module, coupled with the Wirepas Mesh routing technology, enables a sensor battery life of over 5 years and supports up to 4 billion devices in a single network.

Wirepas Mesh wireless connectivity software technology includes all the networking intelligence required to form a resilient and large-scale wireless mesh network. Wirepas Mesh enables all devices in the network to function as routers for other devices, creating a self-healing network, optimized by local decision making to reach unlimited scalability, coverage, and density while using the available radio spectrum as efficiently as possible.

The MBN52832 Bluetooth Low Energy module enables ultra-low power connectivity for data communications. It integrates Nordic Semiconductor’s Bluetooth Low Energy IC, an RF front end, and crystal into a very small form factor. A built-in Arm Cortex M4 core with 64 kB of RAM and 512 kB of flash provides a high-performance engine and rich interface for a variety of IoT applications, including medical and healthcare and machine-to-machine (M2M) applications.

Murata, www.murata.com; Wirepas, www.wirepas.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.