Renesas Electronics and 3db Access Collaborate on Secure UWB

March 16, 2020

Renesas plans to add 3db Access’s secure ranging UWB access to chips for automotive, IoT, and consumer applications.

Secure ultra-wideband (UWB) access for the connected smart home, internet of things (IoT), Industry 4.0, mobile computing, and connected vehicle applications is the goal for a collaboration between Renesas Electronics and 3db Access AG, a fabless semiconductor company specializing in secure, low-power UWB chips. In licensing 3db Access’s UWB technology, Renesas will augment its microcontrollers (MCUs) and RF connectivity capabilities with 3db Access’s secure ranging UWB chips, which are designed for use in smartphones, smart watches, automobiles, and other IoT applications. The collaboration also gives Renesas customers access to advanced UWB solutions that are IEEE 802.15.4z dual HRP/LRP-compliant and utilize an RF architecture that achieves 10x lower power consumption through the support of LRP mode. 3db Access’s devices are also claimed to provide the smallest UWB silicon area compared to competitive ICs.

The two organizations are hoping to provide customers with products and tools to jumpstart development for indoor positioning, mobile payments, and asset tracking. Both companies are discussing terms of business engagement that will enable 3db Access to develop new UWB solutions for every market space, in addition to bringing existing UWB solutions to the Renesas portfolio.

Renesas Electronics, www.renesas.com; 3db Access AG, www.3db-access.com

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David Maliniak | Executive Editor, Microwaves & RF

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.