Third-Gen 5G mmWave ICs Simplify Active-Antenna-Array Design

Feb. 27, 2020

Anokiwave’s latest millimeter-wave 5G ICs deliver a complete RF signal chain for 24/26-GHz, 28-GHz, and 37/39-GHz bands.

David Maliniak

In its third generation of silicon ICs for millimeter-wave (mmWave) 5G communications, Anokiwave offers a complete RF signal-chain platform for all millimeter-wave bands in play, including 24/26 GHz, 28 GHz, and 37/39 GHz, while providing extensive functionality that simplifies the design of active antenna arrays. The scalable architecture underpinning the IC family supports everything from mmWave 5G macro cells to small cells to customer premises equipment (CPE).

The chips, which are available now in mass-market quantities, span the 5G use-case spectrum with intelligent array solutions. Anokiwave partner GLOBALFOUNDRIES provides full turnkey production and mmWave test capabilities. High levels of integration, three generations of experience in active-antenna ICs, and cost structures that come with fabrication on 300-mm-diameter wafers result in a chip family that’s well-suited for base stations and small cells that resemble Wi-Fi access points.

The ICs are each packaged in a small WLCSP (wafer-level chip-scale package), easily fitting within the small lattice spacings at mmWave levels. Anokiwave offers evaluation kits to ease adoption of the technology and capabilities. The kits include boards with the IC, USB-SPI interface module with drivers, and all required cables.

Anokiwave, www.anokiwave.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.