Flexible Cable Assemblies Serve RF Applications

Aug. 14, 2023
Times Microwave's InstaBend coaxial cable assemblies and TLMP push-on connectors can combine to provide designers with a vibration-proof solution for avionics applications that handles high power and high voltages.
Sherry Petrakis, sales director for North American military sales at Times Microwave Systems, took some time to speak with us about the company'sInstaBend family of highly flexible, coaxial microwave assemblies designed for interconnects between RF circuit cards, modules and enclosure panels. The cable can be bent very closely behind the connector, simplifying cable routing.

Sherry also described the company's Times Locking Miniature Push-on (TLMP) connectors. They represent an evolution of SMP/SMPM connectors by providing improved environmental, shielding, and power characteristics in a single interconnect that handles from DC to 60 GHz.

The vibration-proof connectors won't come undone under the stressful conditions of rugged defense applications. The figure shows how the connectors lock closed with color-coded indication of a positive mate. They'll also handle high power and high voltages at higher altitudes, thanks to a design that overlaps the insulators, cutting off a direct path to ground from the center conductor to the outer shield.

Here's a transcript of the video (it has been edited for clarity):

What we are looking at this year and proposing for our customers to find technical solutions is our InstaBend product. You can bend it right behind the connector. You have a nice opportunity to get into small areas and offer great performance and phase stability over any frequency.

In addition to that, we have our proprietary design of TLMP connector, which is a small connection interface that solves the mechanical issues of an SMPM connector. The TLMP connector is a proprietary design from Times Microwave that fits into applications in any commercial products or even test and measurement. For demanding products, to get the high performance you need, reach out to Times Microwave. We’re here to help you.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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