Tiny MEMS Resonators Hold Key to Smaller, Low-Power IoT/IIoT Edge Devices

These chip-scale or bare-die devices ease integration into designs while providing superior performance characteristics on a variety of fronts, including stability, ruggedness, and power consumption.
Oct. 24, 2025
2 min read

Key Highlights

  • Miniature size (0.46 x 0.46 mm) reduces PCB area by up to 7X compared to traditional quartz devices.
  • Available co-packaged with SoCs or MCUs, simplifying integration and reducing component count.
  • Offers up to 50% less oscillator circuit power and 3X faster startup times than legacy devices.
  • Provides up to 5X tighter frequency stability across a wide temperature range (-40 to 125°C).
  • Designed for rugged environments with up to 50X higher shock and vibration resistance.

The Overview: Tiny Resonators Built for Integration into Edge Devices

Coming in at least 4X smaller than the tiniest quartz-based alternatives, SiTime’s Titan Platform MEMS resonators bring a host of advantages to timing applications: Aside from their miniature physical size, the devices are available co-packaged with SoCs or MCUs for use in demanding edge applications.

Who Needs It & Why: Low Power Draw for Wearables, Medical Devices, and IoT/IIoT

There’s been a steady flow of improvements in MEMS technologies over recent years, not least of which has been manifested in SiTime’s FujiMEMS foundational MEMS technology, now in its sixth generation.

Designers want to apply the low power consumption and precision of MEMS timing devices to connected, battery-powered devices, in which the market demands smaller overall sizes and longer operating periods. This applies to edge devices such as wearables like smart watches, fitness bands and rings, glucose monitors, and smart glasses. Medical devices, e.g., hearing aids, implantables, and biosensors, can also gain from longer batter life.

And then there’s the billions of smart-home and industrial IoT sensors, asset trackers, and other systems that need to be more compact, rugged, and efficient.

Under the Hood: Tight Timing Specs, Ruggedness, and Implementation Flexibility

The Titan Platform MEMS resonators offer two flexible implementation paths. They can be mounted on printed circuit boards (PCBs) for rapid assimilation into a production flow, or they can be co-packaged as bare die with SoCs or MCUs. The latter path eliminates the need for a discrete resonator on the PCB.

How small are the resonators? In their 0505 chip-scale packages (0.46 × 0.46 mm), the devices fill 7X less PCB area than a 1210-packaged quartz device and 4X less than a 1008-packaged quartz part. They're said to require up to 50% less oscillator circuit power and start up 3X faster than legacy devices with lower startup energy requirements.

The resonators provide up to 5X tighter frequency stability across temperatures from –40 to 125°C. And, they're claimed to provide up to 50X more shock and vibration resistance than quartz devices.

Production samples of the 32-MHz Titan SiT11100 are available now. Engineering samples of higher-frequency devices (up to 76.8 MHz) will be available in December 2025.

About the Author

David Maliniak

Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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