Low-Profile Capacitors Span 1 .0 To 3.3 mF

June 17, 2010
A new range of tantalum capacitors is designed for applications that require bulk capacitance to boost transmitter power. Examples include PCMCIA/USB wireless express cards, smart meters, GPS transmitters, and GSM high-speed wireless data handling. ...

A new range of tantalum capacitors is designed for applications that require bulk capacitance to boost transmitter power. Examples include PCMCIA/USB wireless express cards, smart meters, GPS transmitters, and GSM high-speed wireless data handling. Two case sizes of tantalum products are available. Case sizes "6" (14.5 x 7.5 x 2.0 mm) and "4" (7.3 x 6.1 x 2.0 mm) are rated from 1000 to 3300 F (3.3 mF) with a voltage rating of 4 to 10 V. Their maximum case height of 2 mm makes the PulseCap series ideal for reduced-height applications. In addition, the "undertab" termination style replaces traditional "J" leads with terminations that do not protrude outside of the outline of the case. This approach increases volumetric efficiency while allowing parts to be positioned closely together. The PulseCap devices can withstand a soldering profile of 3X reflow temperature at +260C. They operate from -55 to +125C. P&A: Starting at $1.80 each; Typical lead time is 14 to 20 weeks.

AVX Corp.
801 17th Ave. South
Myrtle Beach, SC 29578
(843) 448-9411, FAX: (843) 444-2864
Internet: www.avx.com.

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About the Author

Nancy Friedrich | RF Product Marketing Manager for Aerospace Defense, Keysight Technologies

Nancy Friedrich is RF Product Marketing Manager for Aerospace Defense at Keysight Technologies. Nancy Friedrich started a career in engineering media about two decades ago with a stint editing copy and writing news for Electronic Design. A few years later, she began writing full time as technology editor at Wireless Systems Design. In 2005, Nancy was named editor-in-chief of Microwaves & RF, a position she held (along with other positions as group content head) until 2018. Nancy then moved to a position at UBM, where she was editor-in-chief of Design News and content director for tradeshows including DesignCon, ESC, and the Smart Manufacturing shows.

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