Smiths Interconnect
1021 Mw Smiths Interconnect K Band Passive Components Promo 617022aa903cc

K-band Passive Components Serve Space Applications

Oct. 20, 2021
Isolators, circulators, iso-adapters, and loads are born of an extensive product line and are specifically engineered to reduce cost and NRE charges for users.

The Overview

Smiths Interconnect’s broad range of K-band passive components for satellite communication payloads in GEO/MEO and LEO orbits includes coaxial and WR51 isolators, circulators, and iso-adapters; waveguide loads, and microstrip isolators.

Who Needs It and Why?

Building on over 30 years of experience and flight heritage, the company’s many potential design variants, all of which are specifically engineered to meet the needs of spaceflight applications, enables it to exploit a very large product portfolio to minimize non-recurring costs for users. These highly compact and ruggedized K-band passive components are rigorously qualified for spacecraft use in the company’s state-of-the-art test and qualification laboratory in Dundee, Scotland. Qualification comprises sine and random vibration, mechanical shock, and, where appropriate, RF power TVAC, average power and multipaction, and critical power testing. Summary and qualification data reports are available to prospective customers.

Under the Hood

The company’s K-band coaxial and WR51 isolators, circulators and iso-adapters, waveguide loads and microstrip isolators are broadband devices and, as such, require fewer part options to address the allocated frequency band. They are temperature-stable and multipaction-free.

They are provided with a standard clear passivation coating but can be supplied with a low-emissivity black paint finish if desired. Their design is optimized for reliability and minimizes cost and application risks. Mechanical variants (circulation, flange detail, and more) are available on request.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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