Jam-Resistant Communications Module Targets Defense, UAV Markets
The surging global adoption of drones in defense, homeland security, public safety, and commercial uses is driving demand for secure and resilient communications technologies with higher bandwidth and lower latencies. Peraso’s PRM2145 60-GHz communications module eschews the congestion of lower-frequency bands to provide unmanned aerial vehicle (UAV) RF engineers with a lightweight, compact module that serves airborne platforms with size, weight, and power (SWaP) constraints.
Through use of advanced beamforming technology, the module creates highly directional links intended to be difficult to detect, intercept, or disrupt. This architecture provides significant advantages for defense and security applications, where communications resilience and operational security are paramount.
The PRM2145 module brings gigabit-class wireless throughput and ultra-low latency in real-time control and video-transport applications. It offers enhanced resistance to jamming, interference, and spectrum congestion.
The module, expected to be available in Q4 2026 for customer evaluation, is designed for integration into a broad range of unmanned and autonomous platforms. These include tactical drones, loitering munitions, ISR systems, autonomous ground vehicles, and advanced robotic systems.
Learn more about mmWave technology and UAVs
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.