Iridium’s PNT ASIC Brings Resilient GNSS Protection to Devices Worldwide
Since the unveiling of Iridium Communications’ PNT ASIC last fall, designers have clamored for commercial access to the chip, which is designed to help protect GPS- and GNSS-dependent systems from jamming, spoofing, and other threats. The company announced that the chip is now widely available to customers in the maritime, unmanned and autonomous systems (UXV), aviation, telecommunications, and other critical infrastructure sectors.
The device, which measures 8 × 8 mm and weighs less than 0.2 grams, expands access to assured positioning, navigation, and timing (PNT) technologies at scale. It delivers cryptographically secure timing and location data from the Iridium satellite network through one-way signal bursts that are powerful enough to work where traditional GNSS often cannot, including inside structures and in contested environments.
By continuously validating signal integrity and delivering trusted PNT data anywhere on Earth, the Iridium PNT ASIC provides a powerful new foundation not only for resilient navigation, but also timing.
As global reliance on GNSS continues to grow, so does the frequency and sophistication of signal interference such as jamming and spoofing. The world faces increasing operational and safety risks associated with GNSS spoofing and jamming across commercial transportation, aviation, and critical infrastructure environments.
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.