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One IoT FEM Covers Thread, Zigbee, Wi-Fi, and Bluetooth

Sept. 23, 2024
pSemi‬'s 2.4-GHz FEM supports several popular IoT protocols, numerous Bluetooth variants, and Wi-Fi.

The Overview: An IoT FEM With Versatile Connectivity

pSemi’s PE562212 is a tiny multi-protocol, 2.4-GHz front-end module (FEM) that brings versatility to makers of IoT devices. The highly integrated silicon-on-insulator FEM includes an RF power amplifier, low-noise amplifier, and control logic in a package suited for space-constrained PCBs.

Who Needs It & Why: IoT Device Makers Seeking Options

The PE562212 provides IoT designers with a bevy of options for connectivity, considering that it's designed for Thread, Zigbee, Bluetooth BDR/EDR, and Bluetooth LE applications. It’s also capable of low-to-medium Wi-Fi throughput for devices that require firmware upgrades, or for applications with the need for increased data traffic.

One might use the PE562212 in an IoT device for, say, Bluetooth connectivity to a smartphone. But it also offers the ability to perform firmware upgrades over Wi-Fi. It’s said to offer a balance of efficiency and linearity, enabling it to handle these disparate functions.

While also serving proprietary 2.4-GHz applications, the device links all sorts of smart devices using the Thread and Matter protocols. Smart speakers, lighting, and thermostats can be connected, as can IoT hubs, range extenders, wearables, sensors, and more. IIoT applications abound, too, such as asset tracking and industrial devices.

Under the Hood: Solid Banner Specifications

On top of its compact size and high integration, the PE562212 delivers up to +21-dBm output power and digital transmit-gain control in 1-dB steps with 15-dB range. In addition, the device offers impressive receive capabilities with a typical noise figure of 1.5 dB and a low-loss bypass path (0.9 dB typical) with a GPIO interface.

PCB routing is simplified by the PE562212 because it requires no external SMD components, such as control lines, supply lines, and RF traces. Packaged in a 14-lead 1.8- × 1.8- × 0.7-mm LGA package, the device is available in sample quantities now.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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