Finding PCBs That Can Take The Heat

May 20, 2014
Special requirements are needed for PCB materials designed to handle high power levels and high heat levels.

Among the many exhibitors at the upcoming IEEE 2014 IMS in Tampa, members of Rogers Advanced Circuit Materials (ACM) will be on hand at booth 1833 to help visits choose printed-circuit-board (PCB) materials. The firm offers many different types of materials, notably for RF/microwave circuit applications through millimeter-wave frequencies. On hand also will be the firm’s senior market development engineer, John Coonrod, perhaps best known for the company’s regular blog on using circuit materials. He will be in Tampa to make a Microwave Application Seminar (MicroApps) presentation (June 4, 9:30 AM), “The Impact of Circuit Material Properties on Microwave PCB’s RF Heating Patterns.” He will explain how different circuit materials respond to different power levels and how designers can handle the heat.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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