Wideband, Direct-RF SoC FPGAs Boost DSP Capabilities at the Edge
As RF systems become more complex, particularly in the aerospace, defense, and advanced communications markets, designers must target processing of wider bandwidths, real-time responses, and more capabilities within tight size, weight, and power (SWaP) and latency constraints.
Through a tightly integrated architecture that combines high-speed data converters, programmable logic, and processing elements, Altera’s next-generation Agilex 9 Direct RF Series SoC FPGAs are said to deliver a 40% increase in compute capability per square millimeter.
As a result, RF systems are able to process and analyze signals closer to the edge while adapting to mission requirements. At the same time, wideband RF system designers can reduce complexity, manage power, and meet real-time performance demands where latency and responsiveness are critical.
Some key features of the Agilex 9 devices include:
- Up to eight channels of 64-GSPS ADCs/DACs
- Up to 16 channels of 12-GSPS DACs and 20 channels of 4-GSPS ADCs
- Converters combined with 38 TFLOPS of DSP performance.
The new Agilex 9 device delivers 45% greater logic and DSP density compared to the previous generation, along with support for next-generation DDR5 and LPDDR5 memory technologies. With integrated 64-GSPS wideband RF as well as more compute and memory resources, the programmable solution eliminates the need for multichip designs while enabling more advanced beamforming for radar and data cube processing.
The highly integrated RF platform supports high-bandwidth signal capture and generation, allowing customers to scale performance while maintaining the flexibility to evolve their designs over time.
Related links:
Learn more about edge processing technologies
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.
About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.