Dual-Channel mmWave Block Converter RF+ SiPs Span 18 to 40 GHz
As designers chase operating frequencies into the mmWave region, Spectrum Control's new family of dual-channel block converter RF+ SiPs (system-in-packages) serves as compact, characterized frequency-conversion building blocks for high-channel-density RF and microwave systems.
These SCi Blocks solutions integrate RF conversion, filtering, gain control, power regulation, RF detection, and temperature monitoring in compact, production-ready packages. By replacing multiple discrete mmWave converters with integrated two-channel RF+ SiPs, the devices help engineers reduce board-level design complexity, sourcing burdens, tuning efforts, and integration risk.
The family includes three configurations: an SCRS-00-1006 dual-channel downconverter, SCRS-00-1007 dual-channel upconverter, and SCRS-00-1008 transceiver with one receive and one transmit channel. Each configuration supports 18 to 26 GHz and 26 to 40 GHz, enabling designers to address a broad range of EW/SIGINT, radar, aerospace/defense, and test applications.
The downconverter configuration converts 18- to 26-GHz and 26- to 40-GHz RF inputs to IF outputs of 6.25 to 14.25 GHz and 3 to 17 GHz. The upconverter configuration accepts corresponding IF input ranges and outputs of 18- to 26-GHz or 26- to 40-GHz RF signals. The transceiver configurations combine single downconversion and upconversion paths in the same compact RF+ SiP architecture.
Each channel supports 26-dB digital gain control in 0.5-dB steps, 300-ns attenuator settling, and 1-µs band-select switching. The devices are designed to operate across –40 to +85°C and are optimized for volume production and supply-chain risk reduction.
The dual-channel block converter family is offered as compact, surface-mount RF+ SiPs for direct integration onto customer PCBs. The 30-mm2 package supports new designs, respins, and high-density architectures that require compact frequency-conversion capability without the size and integration burden of separate converter assemblies.
Learn more about modular system architectures
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.