More Products of the Week: March 14, 2024

March 14, 2024

We get a multitude of interesting new products every day—here's a second selection for this week.

IR transceiver modules by Vishay Intertechnology

IR Transceivers Provide Longer Link Distances and Greater ESD Robustness

Vishay Semiconductors, part of Vishay Intertechnology, has upgraded its TFBS4xx and TFDU4xx Series of IR transceiver modules for IrDA applications. These drop-in replacements for existing applications offer 20% longer link distance and ESD robustness up to 2 kV. Supporting data rates up to 115.2 kb/s (SIR) and link distances of 1 meter, the devices serve wireless communication and data transmission in energy meters and monitors, industrial automation controls, mobile phones, and medical equipment.

These transceiver modules consist of a PIN photodiode, infrared emitter (IRED), and low-power control IC in a single package. Having been upgraded to the company’s latest in-house IC and surface emitter chip technology, Vishay promises long-term availability for these devices that, because they are drop-in replacements for existing devices, save costs by eliminating the need for PCB redesigns.

To increase battery life in portable devices, the modules offer low power consumption with an idle supply current of < 70 μA, down to < 1 μA in shutdown mode. They're offered in top- and side-view surface-mount packages of various sizes and feature a wide operating voltage range from 2.4 to 5.5 V and an operating temperature range from -25 to +85°C.

Samples and production quantities of the upgraded IR transceiver modules are available now. Pricing for U.S. delivery starts at $2.00 per piece.

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.