More Products of the Week: March 14, 2024

March 14, 2024

We get a multitude of interesting new products every day—here's a second selection for this week.

Automotive-grade superjunction MOSFETS by STMicroelectronics

Automotive-Grade MOSFETs Suit On-Board Chargers and DC-DC Converters

STMicroelectronics added automotive-grade, 600-V/650-V superjunction MOSFETs to its STPOWER MDmesh DM9 AG series. These devices offer high efficiency and ruggedness in applications like on-board chargers (OBCs) and DC-DC converters in both hard- and soft-switching topologies.

Thanks to outstanding R_DS(on) per die area and minimal gate charge, these devices lose little energy and offer fast switching. Compared to the previous generation, the latest MDmesh DM9 technology ensures a tighter gate-source threshold voltage (V_GS(th)) spread that results in sharper switching for lower turn-on and turn-off losses.

Not only that, but body-diode reverse recovery is improved, which increases the MOSFETs’ overall ruggedness. The diode’s low reverse-recovery charge (Q_rr) and fast recovery time (t_rr) lend the MDmesh DM9 AG series to phase-shift zero-voltage switching topologies that demand very high efficiency.

The first device in the new STPOWER MDmesh DM9 AG series is the STH60N099DM9-2AG, a 27-A, AEC-Q101 qualified, N-channel, 600-V device in H2PAK-2 SMT packaging, with 76-mΩ typical R_DS(on). The family will grow to provide a full range of devices, covering a broad range of current ratings and R_DS(on) from 23 mΩ to 150 mΩ.

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.